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PADS Professional For Complex PCB Designs

June 13, 2018
10:00 AM - 11:00 AM (PDT)
Online Webinar via RingCentral/Zoom
padsprofessional

Now the Power of Xpedition in PADS!

Overview
PADS Professional is a suite of tools for PCB development, including schematic, analog design, signal and power integrity, thermal analysis, layout/routing, and manufacturing preparation. PADS Professional is scalable to fit your needs, both now and in the future with optional configurations and options for RF Design, Advanced 3D, Advanced Signal/Power Integrity, electrical DRC, and FPGA IO planning and synthesis. Advanced features available include Central Library, Constraint Management, Sketch routing, PCB/MCAD Collaboration, Archive Management, and a Starter Library with over 10K IPC-compliant parts

Join EDA Direct to learn about the new features in PADS Professional and how it can improve productivity for your complex design challenges from schematic design to manufacturing

What you will learn:
    • How to use PADS central database to setup design rules and constraints with online DRC for Class, net, groups, Pin Pairs, conditional and component rules.
    • How to setup high-speed rules for diff pairs, match lengths, max/min lengths for DDRx.
    • How to use Component Explorer and Net Explorer to view component layout and netlines for marked nets and components to reduce the time required for complete placement.
    • How to use sketch routing for complex interfaces, such as DDRx with tuning of high speed nets.
    • How to visualize and validate PCB designs as if it was already Manufactured using 2D and 3D capabilities.
    • How advanced layout and routing features such as real-time DRC, bi-directional cross-probing, split/mixed planes, and physical design reuse.
    • How sketch routing can optimize routes for complex interfaces such as DDRx with tuning.
    • How SI analysis can be used to detect over/undershoot, ringing, crosstalk, and timing issues
    • How Thermal Analysis can help you identify any potential “hot spots” in the design using conduction, convection, and radiation cooling analysis.
    • DDR, DC Drop and Electrical DRC capabilities and how it can improve productivity for complex design challenges from schematic design to manufacturing.

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